A thin film thermoelectric cooler for chip-on-board direct assembly

Author

Lee, Hyunju ; Park, Soonseo ; Cho, Sungkyu ; Kim, Hyojong ; Kim, Shiho

Author_Institution

Dept. of Electr. Eng., Chungbuk Nat. Univ., Cheongju, South Korea

fYear

2009

fDate

2-4 Dec. 2009

Firstpage

1

Lastpage

4

Abstract

A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.

Keywords

assembling; chip-on-board packaging; cooling; thermoelectric devices; thin film circuits; COB direct assembly; active ondemand cooling; chip-on-board direct assembly; die chip; metal plate; supperlattice based thermoelectric material; thin film solid state cooler; thin film thermoelectric cooler; Assembly; Bonding; Cooling; Heat pumps; Semiconductor device packaging; Semiconductor thin films; Thermal management; Thermoelectricity; Thin film transistors; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE

Conference_Location

Shatin, Hong Kong

Print_ISBN

978-1-4244-5350-4

Electronic_ISBN

978-1-4244-5351-1

Type

conf

DOI

10.1109/EDAPS.2009.5403990

Filename

5403990