DocumentCode :
3360317
Title :
Optimized 25 V, 0.34 m/spl Omega//spl middot/cm/sup 2/ very-thin-RESURF (VTR), drain extended IGFETs in a compressed BiCMOS process
Author :
Chin-Yu Tsai ; Arch, J. ; Efland, T. ; Erdeljac, J. ; Hutter, L. ; Mitros, J. ; Yang, J.-Y. ; Yuan, H.-T.
Author_Institution :
Corp. Res. & Dev., Texas Instrum. Inc., Dallas, TX, USA
fYear :
1996
fDate :
8-11 Dec. 1996
Firstpage :
469
Lastpage :
472
Abstract :
The competitive PC peripheral application market drives the goal to develop a compressed, low-cost BiCMOS power technology with state-of-the-art specific-on-resistance (R/sub sp/) at the 20 V node. The 20 V rated lateral power device is difficult to optimize because modern VLSI processes tend to physically limit surface BV to about 13-19 V in planar devices. Here the structure performance is advanced by optimizing a Very-Thin-RESURF (VTR) region (VTR Xj=0.3 /spl mu/m). This work presents a planar VTR drain extended IGFET with best case BV=25 V and R/sub sp/=0.34 m/spl Omega//spl middot/cm/sup 2/@V/sub gs/=10 V using a compressed BiCMOS VLSI, 1 /spl mu/m technology. Structure variation and thermal performance are characterized.
Keywords :
BiCMOS integrated circuits; VLSI; circuit optimisation; insulated gate field effect transistors; integrated circuit measurement; ion implantation; power integrated circuits; 1 mum; 25 V; MEDICI; TSUPREM; VT implants; compressed BiCMOS VLSI; lateral power device optimization; low-cost BiCMOS power technology; specific-on-resistance; structure performance; structure variation; thermal performance; very-thin-RESURF drain extended IGFETs; Back; BiCMOS integrated circuits; Body regions; Computational modeling; Electrons; Immune system; Implants; Medical simulation; Video recording; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1996. IEDM '96., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-3393-4
Type :
conf
DOI :
10.1109/IEDM.1996.553628
Filename :
553628
Link To Document :
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