Novel electrical modelling and measurement technique of hybrid package (FusionQuad) for characterization of RF and high speed signals

Author

Lee, SeungJae ; Bae, KiCheol ; Yu, Jiheon ; Chung, YoungSuk ; Hwang, ChanHa ; Lee, ChoonHeung

Author_Institution

R&D Center, Amkor Technol. Korea, Inc., Seoul, South Korea

fYear

2009

fDate

2-4 Dec. 2009

Firstpage

1

Lastpage

4

Abstract

This paper discuss electrical characterization of new developed hybrid package, FusionQuad, that is converging QFN and TQFP type package to have good electrical performance with high I/O pin counts. Precise electrical modelling from wire-to-motherboard is performed by using simple organic based test die with de-embedding technique to cope with limits of assembly process. Measurements are done in the frequency domain to extract S-parameter up to 10 GHz.

Keywords

S-parameters; electronics packaging; printed circuits; FusionQuad; QFN type package; RF characterization; S-parameter extraction; TQFP type package; de-embedding technique; electrical characterization; electrical measurement technique; electrical modelling; frequency 10 GHz; hybrid package; organic based test die; wire-to-motherboard; Assembly; Frequency domain analysis; Frequency measurement; Measurement techniques; Packaging; Performance evaluation; RF signals; Radio frequency; Scattering parameters; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE

Conference_Location

Shatin, Hong Kong

Print_ISBN

978-1-4244-5350-4

Electronic_ISBN

978-1-4244-5351-1

Type

conf

DOI

10.1109/EDAPS.2009.5404000

Filename

5404000