DocumentCode
3360527
Title
A Reconfigurable Built-In Self-Repair Scheme for Multiple Repairable RAMs in SOCs
Author
Tseng, Tsu-Wei ; Li, Jin-Fu ; Hsu, Chih-Chiang ; Pao, Alex ; Chiu, Kevin ; Chen, Eliot
Author_Institution
Dept. of Electr. Eng., Nat. Central Univ., Jungli
fYear
2006
fDate
Oct. 2006
Firstpage
1
Lastpage
9
Abstract
This paper presents a reconfigurable built-in self-repair (ReBISR) scheme for multiple repairable RAM cores with different sizes and redundancy organizations (i.e., spare rows/spare columns or spare rows/spare IOs). We also propose an efficient built-in redundancy-analysis (BIRA) algorithm for allocating redundancies for the ReBISR scheme. A reconfigurable BIRA (ReBIRA) circuit is realized to perform the proposed BIRA algorithm for the ReBISR scheme. Experimental results show that the ReBISR scheme can achieve high repair rate (i.e., the ratio of the number of repaired memories to the number of defective memories). The area cost of the reconfigurable BIRA is very small, e.g., the area cost is only about 1.5% if 512times4times256 design parameters and four memory instances (64times2times32, 128times2times64, 256times4times128, and 512times4times256) are considered. Also, the ratio of the redundancy analysis time to the test time is very small, e.g., the ratio for a 512times4times256-bit memory tested by a March-14N algorithm with solid data backgrounds is only about 0.25%
Keywords
built-in self test; integrated circuit testing; logic testing; random-access storage; system-on-chip; March test; ReBISR scheme; built-in redundancy-analysis algorithm; multiple repairable RAM cores; random access memory; reconfigurable BIRA circuit; reconfigurable built-in self-repair scheme; system-on-chip; Algorithm design and analysis; Circuit faults; Circuit testing; Costs; Hardware; Heuristic algorithms; Random access memory; Read-write memory; Redundancy; Solids; Built-in self-repair; RAMs; SOCs; built-in redundancy-analysis; march test; reconfigurable; redundancy;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2006. ITC '06. IEEE International
Conference_Location
Santa Clara, CA
ISSN
1089-3539
Print_ISBN
1-4244-0292-1
Electronic_ISBN
1089-3539
Type
conf
DOI
10.1109/TEST.2006.297688
Filename
4079366
Link To Document