Cost Effective Outliers Screening with Moving Limits and Correlation Testing for Analogue ICs

In order to meet the zero-defect product quality requirements on ICs by the automotive industry, new test methods are needed to screen out the outliers that give potential lifetime failures. In this paper, how to apply the combination of moving limits and multiple-parameter correlation testing to the production testing of analogue IC is discussed. Moving limits is the technique that uses the measurement results of the neighboring dies to tighten the test limits. Multiple-parameter correlation testing is the technique that uses the measurement results of the different blocks within the chip as the secondary information. Moreover, in our work, an automotive transceiver with high volume production has been used as the test vehicle to demonstrate the effectiveness of this combination approach. The collected wafer map data, failure analysis of the rejects, the reduction trend of the customer returns, the yield information and test cost information show that the proposed new test approach is cost effective and can improve the outgoing product quality