• DocumentCode
    3360622
  • Title

    Robust ultra-low voltage ROM design

  • Author

    Seok, Mingoo ; Hanson, Scott ; Seo, Jae-sun ; Sylvester, Dennis ; Blaauw, David

  • Author_Institution
    Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI
  • fYear
    2008
  • fDate
    21-24 Sept. 2008
  • Firstpage
    423
  • Lastpage
    426
  • Abstract
    SRAM dominates standby power consumption in many systems since the power supply cannot be gated as in logic blocks. The use of ROM for parts of instruction memory can alleviate this power bottleneck in mobile sensing applications such as implantable biomedical and environmental sensing systems, which can spend up to 99% of their lifetimes in standby mode. However, robust ROM design becomes challenging as the supply voltage is reduced aggressively. In this paper, three different ROM topologies are investigated and compared for ultra-low voltage operation. A simple method to estimate the theoretical robustness at low voltage is proposed and applied to the ROM topologies. A test circuit fabricated in a carefully-selected 0.18 mum CMOS technology reveals that our proposed static NAND ROM structure improves performance by 26X, energy by 3.8X and lowest functional supply voltage by 100 mV over a conventional dynamic NAND ROM.
  • Keywords
    CMOS memory circuits; SRAM chips; integrated circuit design; integrated circuit testing; logic design; low-power electronics; read-only storage; CMOS technology; NAND ROM; ROM topology; SRAM; instruction memory; mobile sensing application; power consumption; power supply; size 0.18 mum; test circuit; ultra-low voltage ROM design; CMOS technology; Circuit testing; Circuit topology; Emergency power supplies; Energy consumption; Logic gates; Random access memory; Read only memory; Robustness; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2018-6
  • Electronic_ISBN
    978-1-4244-2019-3
  • Type

    conf

  • DOI
    10.1109/CICC.2008.4672110
  • Filename
    4672110