Title :
Design rules to optimise the layout of the multilayer circuit packages at 60GHz
Author :
Abeygunasekera, Anne ; Free, Charles
Author_Institution :
Adv. Technol. Inst., Univ. of Surrey, Guildford, UK
Abstract :
New practical design data have been obtained relating to the effects of coupling between conductors in highly integrated, multilayer circuits working at millimeter-wave frequencies. Data has been obtained on various cross-over and coupled line structures at 60 GHz. The practical circuits were fabricated using photoimageable thick-film technology. Design rules have been developed to provide guidance to the circuit designer on the minimum spacing between conductors in a multilayer package, thus achieving an optimum compromise between good isolation and minimum package size.
Keywords :
MIMIC; conductors (electric); integrated circuit layout; integrated circuit packaging; thick films; circuit designer; conductors; coupled line structures; coupling effects; frequency 60 GHz; millimeter-wave frequencies; multilayer circuit package layout; photoimageable thick-film technology; Conductors; Coupling circuits; Design optimization; Frequency; Integrated circuit technology; Isolation technology; Millimeter wave integrated circuits; Millimeter wave technology; Nonhomogeneous media; Packaging;
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE
Conference_Location :
Shatin, Hong Kong
Print_ISBN :
978-1-4244-5350-4
Electronic_ISBN :
978-1-4244-5351-1
DOI :
10.1109/EDAPS.2009.5404018
