Title :
On application of multicomponent copper alloys for making microstrip line conductors of EHF microcircuits
Author :
Bessonov, V.A. ; Barantsev, S.A. ; Uliyanova, L.L.
Author_Institution :
Sci. Res. Technol. Inst. of Instrum. Eng., Kharkov, Ukraine
Abstract :
The purpose of our work is to develop new compositions for copper alloys in order to reduce electromagnetic energy losses in microstrip lines providing invariability of a high conductor adhesion to an insulator substrate, fine weldability and solderability of these microstrip lines. It is proposed to use the multicomponent fractionatable copper alloys Cu-Mg-Cr-Ti and Cu-Mg-Ge-Sn during thermal evaporation where the “gradient” films with required parameters are being formed
Keywords :
adhesion; chromium alloys; copper alloys; germanium alloys; losses; magnesium alloys; microstrip lines; millimetre wave integrated circuits; soldering; tin alloys; titanium alloys; vapour deposition; CuMgCrTi; CuMgGeSn; EHF microcircuits; conductor adhesion; electromagnetic energy losses; fractionatable alloys; gradient films; microstrip line conductors; multicomponent alloys; solderability; thermal evaporation; weldability; Adhesives; Conducting materials; Conductors; Copper alloys; Energy loss; Microstrip components; Microstrip resonators; Q factor; Substrates; Welding;
Conference_Titel :
Physics and Engineering of Millimeter and Submillimeter Waves, 1998. MSMW '98. Third International Kharkov Symposium
Conference_Location :
Kharkov
Print_ISBN :
0-7803-5553-9
DOI :
10.1109/MSMW.1998.755543
