• DocumentCode
    3360848
  • Title

    Integrated RF-CMOS Transceivers challenge RF Test

  • Author

    Demmerle, Frank

  • Author_Institution
    Infineon Technol. AG, Munich
  • fYear
    2006
  • fDate
    Oct. 2006
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    The CMOS implementation of RF-transceivers for 2G/3G mobile communication standards allows the integration of base-band and RF functions on a single chip at significantly reduced manufacturing cost. Complex RF circuit architectures are now possible, which could not be realized economically before in a mixed bipolar/CMOS technology. This development not only demands for new test methods, but also paves the way for novel test concepts and strategies for a more cost efficient RF test in production. Some aspects of this trend which became apparent during the development of such RF transceivers are discussed and examples are presented of how not only to meet the new demands but also to take benefit of them
  • Keywords
    3G mobile communication; CMOS integrated circuits; integrated circuit testing; radiofrequency integrated circuits; transceivers; 2G mobile communication standards; 3G mobile communication standards; CMOS technology; RF functions; RF test; base-band functions; complex RF circuit architectures; integrated RF-CMOS transceivers; manufacturing cost; mixed bipolar; 3G mobile communication; CMOS technology; Circuit testing; Communication standards; Costs; Integrated circuit technology; Manufacturing; Radio frequency; System testing; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2006. ITC '06. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    1-4244-0292-1
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2006.297704
  • Filename
    4079382