DocumentCode
3360848
Title
Integrated RF-CMOS Transceivers challenge RF Test
Author
Demmerle, Frank
Author_Institution
Infineon Technol. AG, Munich
fYear
2006
fDate
Oct. 2006
Firstpage
1
Lastpage
8
Abstract
The CMOS implementation of RF-transceivers for 2G/3G mobile communication standards allows the integration of base-band and RF functions on a single chip at significantly reduced manufacturing cost. Complex RF circuit architectures are now possible, which could not be realized economically before in a mixed bipolar/CMOS technology. This development not only demands for new test methods, but also paves the way for novel test concepts and strategies for a more cost efficient RF test in production. Some aspects of this trend which became apparent during the development of such RF transceivers are discussed and examples are presented of how not only to meet the new demands but also to take benefit of them
Keywords
3G mobile communication; CMOS integrated circuits; integrated circuit testing; radiofrequency integrated circuits; transceivers; 2G mobile communication standards; 3G mobile communication standards; CMOS technology; RF functions; RF test; base-band functions; complex RF circuit architectures; integrated RF-CMOS transceivers; manufacturing cost; mixed bipolar; 3G mobile communication; CMOS technology; Circuit testing; Communication standards; Costs; Integrated circuit technology; Manufacturing; Radio frequency; System testing; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2006. ITC '06. IEEE International
Conference_Location
Santa Clara, CA
ISSN
1089-3539
Print_ISBN
1-4244-0292-1
Electronic_ISBN
1089-3539
Type
conf
DOI
10.1109/TEST.2006.297704
Filename
4079382
Link To Document