Title :
Lead Free Through Hole Technology (THT) and Contact Repeatability in In-Circuit Test
Author :
Reinosa, Rosa D.
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA
Abstract :
The European Union Restriction of Hazardous Substances (RoHS) Directive banned the use of lead in electronic equipment on July 1st 2006. Contact repeatability performance is an important driver in the selection of lead free materials, as well as, the effects that manufacturing processes (through hole reflow (THR), wave, selective wave) have on testability of PCAs (printed circuit assemblies). In-circuit test probe contact repeatability performance is presented for various lead free material combinations (paste, fluxes, surface finishes) and their impact on test targets that have been exposed to through hole reflow, wave and selective wave manufacturing processes
Keywords :
RoHS compliance; assembling; printed circuit manufacture; printed circuit testing; reflow soldering; European Union Restriction of Hazardous Substances; RoHS Directive; contact repeatability; electronic equipment; fluxes; in-circuit test probe; lead free materials; lead free through hole technology; manufacturing processes; paste; printed circuit assemblies; surface finishes; Assembly; Circuit testing; Driver circuits; Electronic equipment; Environmentally friendly manufacturing techniques; Manufacturing processes; Materials testing; Principal component analysis; Printed circuits; Probes;
Conference_Titel :
Test Conference, 2006. ITC '06. IEEE International
Conference_Location :
Santa Clara, CA
Print_ISBN :
1-4244-0292-1
Electronic_ISBN :
1089-3539
DOI :
10.1109/TEST.2006.297709
