[Front cover]

fYear

2006

fDate

22-27 Oct. 2006

Abstract

The following topics are dealt with: economic decision; delay test; cutting-edge memory test; radiofrequency testing; test smorgasbord; XTREMEATE; jitter; production test; high-speed serial I/O; XJTAG X 3; quality issues; transition-fault testing; fault diagnosis; ADC/DAC testing; system-level high-speed DFT; fault tolerance; error tolerance; microprocessor test; data compression; programming automatic test equipment; automatic test pattern generation; mixed-signal test; soft-error mitigation; soft-error correction; embedded memories; defect screening; test-power reduction; analog/mixed-signal DFT; DFM/DFY; zero defects; system on chip debugging; reuse cores; high-speed I/O tests

Keywords

Q-factor; analogue-digital conversion; automatic test equipment; automatic test pattern generation; computer debugging; data compression; delays; design for manufacture; design for testability; digital-analogue conversion; economics; fault diagnosis; fault tolerance; high-speed integrated circuits; input-output programs; integrated circuit testing; integrated memory circuits; jitter; microprocessor chips; mixed analogue-digital integrated circuits; production testing; radiation hardening (electronics); radiofrequency integrated circuits; system-on-chip; ADC/DAC testing; DFM/DFY; XJTAG X 3; XTREMEATE; analog/mixed-signal DFT; automatic test pattern generation; cutting-edge memory test; data compression; defect screening; delay test; economic decision; embedded memories; error tolerance; fault diagnosis; fault tolerance; high-speed DFT; high-speed I/O test; high-speed serial I/O; jitter; microprocessor test; mixed-signal test; production test; programming automatic test equipment; quality issues; radiofrequency testing; reuse cores; soft-error correction; soft-error mitigation; system on chip debugging; system-level DFT; test smorgasbord; test-power reduction; transition-fault testing; zero defects;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 2006. ITC '06. IEEE International

Conference_Location

Santa Clara, CA

ISSN

1089-3539

Print_ISBN

1-4244-0291-3

Type

conf

DOI

10.1109/TEST.2006.297730

Filename

4079408