Study on the optimization design of flow channels and heat dissipation performance of liquid cooling modules

As the system functions of electronic equipments increase, and the power of micro-electronics elements becomes more and more higher, heat dissipation is more and more taken seriously. The importance of thermal design in electronic equipment is introduced in this paper. Further more, using Flotherm simulatively analyze modules with different flow channel configurations and parameters, so as to obtain such parameters as temperature, flow rate and pressure-loss of different fluid flow. At the same time, by making a comparative analysis on these results, relevant conclusions have been drawn.