Title :
High-Speed I/O Tests in High-Volume Manufacturing: What is Necessary? What is Sufficient?
Author_Institution :
Intel Corp., Santa Clara, CA
Abstract :
Intel Corporation has successfully used DFT and self test methods to enable high volume manufacturing (HVM) of devices with both bidirectional and unidirectional interfaces operating between 1 Gb/s and 2.5 Gb/s on ATE with native data rates of 667 Mb/s or below. Extensions have developed and demonstrated in lab on interfaces up to 20Gb/s. While we continue to rely on full speed functional testing for some of our content we are not driving for ATE that would be capable of the accuracy needed to "measure" the interface performance parameters directly. Can you guess my position?
Keywords :
automatic test equipment; automatic testing; design for testability; integrated circuit manufacture; integrated circuit testing; production testing; 1 to 2.5 Gbit/s; 20 Gbit/s; 667 Mbits/s; automatic test equipment; design for testability; functional testing; high volume manufacturing; self testing; Automatic testing; Circuit testing; Costs; Design for testability; Manufacturing; Relays; Robustness; Semiconductor device measurement; Sockets; Velocity measurement;
Conference_Titel :
Test Conference, 2006. ITC '06. IEEE International
Conference_Location :
Santa Clara, CA
Print_ISBN :
1-4244-0292-1
Electronic_ISBN :
1089-3539
DOI :
10.1109/TEST.2006.297765
