An innovative and low cost Bi-layer method for temporary bonding

Author

Burggraf, Jurgen ; Wiesbauer, Harald ; Bravin, Julian ; Uhrmann, Thomas ; Meynen, Herman ; Civale, Y. ; John, Ranjith ; Sheng Wang ; Peng-Fei Fu ; Yeakle, Craig

Author_Institution

EV Group GmbH, St. Florian am Inn, Austria

fYear

2013

fDate

11-13 Dec. 2013

Firstpage

62

Lastpage

66

Abstract

The purpose of this work was to demonstrate the compatibility of Dow Corning´s temporary bonding solution with EVG´s 850XT universal temporary bonding and debonding platform. The proposed process made use of well-known processing steps and processing modules like spin coating. The process consisted of a release layer (Dow Corning® WL-3001 Bonding Release) and an adhesive layer (Dow Corning® WL-4050 or WL-4030 Bonding Adhesive) using an EVG® 850TB - 300 mm XT frame. Both layers of material were applied by spin coating on the device wafer side. In the frame of this study, silicon carriers were used. Bonding was performed under vacuum at room temperature. A post bonding bake step was applied using a hotplate. After subsequent backside processing steps, the room temperature debonding was performed.

Keywords

adhesive bonding; integrated circuit bonding; Dow Corning WL-4050 bonding adhesive; Dow Corning temporary bonding solution; EVG 850TB; EVG 850XT universal temporary bonding; WL-4030 bonding adhesive; adhesive layer; debonding platform; device wafer side; low cost bilayer method; post bonding bake step; processing modules; release layer; room temperature debonding; silicon carriers; size 300 mm; spin coating; temperature 293 K to 298 K; temporary bonding; Conferences; Decision support systems; Electronics packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th

Conference_Location

Singapore

Print_ISBN

978-1-4799-2832-3

Type

conf

DOI

10.1109/EPTC.2013.6745685

Filename

6745685