Thermal management of hotspots using upstream laminar micro-jet impinging array

The problem of heat removal is likely to become more severe due to the presence of hotspots in the integrated circuit chip. The heat dissipation capability of the upstream laminar micro-jet impinging array is investigated for hotspot cooling. Micro-jet impingement array cooling is an effective method of using liquids to cool electronics where high convective heat transfer rates are required. Several simulations have been implemented on the thermal structure of 4 tiny inline-aligned hotspots to evaluate the heat dissipation capability of the laminar micro-jet impinging array. The effects of the jet diameter, jet pitch and jet-to-wall distance on the Nusselt number, heat convection coefficient, Reynolds number and thermal resistance are studied. The limit of the dissipated heat fluxes of the considered thermal structure are evaluated for the hotspots of different sizes.