Title :
R1 — A reliability comparison study between 14 lead free alloys
Author :
Wohlrabe, Heinz ; Reichelt, Gundolf
Author_Institution :
Centre of Microtechnical Manuf., Dresden Univ. of Technol., Dresden, Germany
Abstract :
The reliability of solder joints is one important part of the quality of SMT-Boards. The paper presents a reliability study named R1. The base of the study is a reliability experiment with 14 different solder alloys (13 lead free solders and a Sn63 alloy as a reference), six different surfaces, six different SMD-chips combined with three different pad layouts. A high cycle reliability test was used. The times of failures were evaluated with the Weibull analysis followed by an analysis of variance.
Keywords :
Weibull distribution; reliability; solders; statistical analysis; surface mount technology; tin alloys; R1 reliability comparison study; SMD-chips; SMT-boards; Sn; Weibull analysis; analysis of variance; high cycle reliability test; lead free alloys; pad layouts; solder joint reliability; time of failures; Environmentally friendly manufacturing techniques; Layout; Metals; Reliability; Shape; Soldering; Substrates;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-2832-3
DOI :
10.1109/EPTC.2013.6745730
