Novel vertical interconnects with 180 degree phase shift for amplifiers, filters, and integrated antennas

Author

Goverdhanam, K. ; Simons, R.N. ; Katehi, L.P.B.

Author_Institution

AT&T Bell Labs., Murray Hill, NJ, USA

fYear

2001

fDate

14-14 Sept. 2001

Firstpage

201

Lastpage

204

Abstract

In this paper, novel low loss, wide bandwidth, compact coplanar stripline/coplanar waveguide vertical interconnects with 180/spl deg/ phase shift and vertically interconnected baluns for RF/microwave integrated circuits are demonstrated. The interconnects and baluns are fabricated on high resistivity silicon wafers with a thin layer of spin-on glass as an insulator between the buried and the elevated strip conductors which are interconnected by microvias. The measured and simulated characteristics of these interconnects are presented and they show that very compact, low loss and wide bandwidth circuits are feasible with this technology. This technology has the potential to significantly enhance the performance of amplifiers, filters, and integrated antennas in Si-SiGe based RF/microwave ICs.

Keywords

baluns; coplanar transmission lines; coplanar waveguides; integrated circuit interconnections; microwave amplifiers; microwave antennas; microwave filters; microwave integrated circuits; strip lines; RF/microwave integrated circuits; Si; Si-SiGe; Si-SiGe based RF/microwave ICs; amplifiers; baluns; buried strip conductors; coplanar stripline vertical interconnects; coplanar waveguide vertical interconnects; elevated strip conductors; filters; integrated antennas; interconnects; low loss circuits; measured interconnect characteristics; phase shift; resistivity; silicon wafers; simulated interconnect characteristics; spin-on glass insulating layer; vertical interconnects; vertically interconnected baluns; wide bandwidth circuits; Bandwidth; Conductivity; Coplanar waveguides; Impedance matching; Integrated circuit interconnections; Integrated circuit technology; Microwave integrated circuits; Radio frequency; Radiofrequency integrated circuits; Stripline;

fLanguage

English

Publisher

ieee

Conference_Titel

Silicon Monolithic Integrated Circuits in RF Systems, 2001. Digest of Papers. 2001 Topical Meeting on

Conference_Location

Ann Arbor, MI, USA

Print_ISBN

0-7803-7129-1

Type

conf

DOI

10.1109/SMIC.2001.942365

Filename

942365