DocumentCode
3363357
Title
Transistor Leakage Components & Effect of Leakage on VCO performance
Author
Dao, Thuy ; Dahl, Phil ; Connell, Larry ; Bushman, Mike
Author_Institution
Freescale Semicond., Lake Zurich
fYear
2007
fDate
May 30 2007-June 1 2007
Firstpage
1
Lastpage
2
Abstract
In the past 10 years, CMOS technology scaling has continued at the rate of every 1 frac12 to 2 years per node. As CMOS technology advanced in to nano technology regime, static power or standby power increases at a much faster rate than dynamic power or active power, and it is expected to dominate the total device power dissipation. In this paper, we will review major leakage components that contributed to the significant rises in standby power and show the relationship between gate leakage and VCO performance. The results clearly show that the projected leakage at the 45 nm node for advanced transistors will result in VCO performance that will not meet the stringent requirements for 3G solutions and beyond unless additional noise reduction techniques are utilized.
Keywords
CMOS integrated circuits; leakage currents; transistors; voltage-controlled oscillators; CMOS technology scaling; VCO; nano technology; size 45 nm; standby power; transistor leakage; voltage-controlled oscillators; 1f noise; CMOS technology; Gate leakage; High K dielectric materials; High-K gate dielectrics; Leakage current; Phase noise; Subthreshold current; Tunneling; Voltage-controlled oscillators;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuit Design and Technology, 2007. ICICDT '07. IEEE International Conference on
Conference_Location
Austin, TX
Print_ISBN
1-4244-0757-5
Electronic_ISBN
1-4244-0757-5
Type
conf
DOI
10.1109/ICICDT.2007.4299539
Filename
4299539
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