• DocumentCode
    3363357
  • Title

    Transistor Leakage Components & Effect of Leakage on VCO performance

  • Author

    Dao, Thuy ; Dahl, Phil ; Connell, Larry ; Bushman, Mike

  • Author_Institution
    Freescale Semicond., Lake Zurich
  • fYear
    2007
  • fDate
    May 30 2007-June 1 2007
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In the past 10 years, CMOS technology scaling has continued at the rate of every 1 frac12 to 2 years per node. As CMOS technology advanced in to nano technology regime, static power or standby power increases at a much faster rate than dynamic power or active power, and it is expected to dominate the total device power dissipation. In this paper, we will review major leakage components that contributed to the significant rises in standby power and show the relationship between gate leakage and VCO performance. The results clearly show that the projected leakage at the 45 nm node for advanced transistors will result in VCO performance that will not meet the stringent requirements for 3G solutions and beyond unless additional noise reduction techniques are utilized.
  • Keywords
    CMOS integrated circuits; leakage currents; transistors; voltage-controlled oscillators; CMOS technology scaling; VCO; nano technology; size 45 nm; standby power; transistor leakage; voltage-controlled oscillators; 1f noise; CMOS technology; Gate leakage; High K dielectric materials; High-K gate dielectrics; Leakage current; Phase noise; Subthreshold current; Tunneling; Voltage-controlled oscillators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuit Design and Technology, 2007. ICICDT '07. IEEE International Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    1-4244-0757-5
  • Electronic_ISBN
    1-4244-0757-5
  • Type

    conf

  • DOI
    10.1109/ICICDT.2007.4299539
  • Filename
    4299539