Simulation of hybrid power components: a new electrothermal model

Author

Farjah, Ebrahim ; Schaeffer, Carsten ; Perret, Robert

Author_Institution

Lab. d´´Electrotech. de Grenoble, St. Martin d´´Heres, France

fYear

1992

fDate

4-9 Oct 1992

Firstpage

1089

Abstract

An electrothermal model for simulating the thermal behavior of hybrid power components is presented. This model consists of an electrical empirical model and a thermal model which uses the finite-element method for the calculation of temperature distribution in the component structure. The procedure for applying this model to a power component under steady-state conditions (during commutation and conduction) is explained, and the results of simulation for a typical hybrid power component, an insulated-gate bipolar transistor, at steady-state forward conduction are presented. The experimental measurements for different power modules show good agreement between the simulated and the experimental characteristics

Keywords

circuit analysis computing; insulated gate bipolar transistors; power transistors; semiconductor device models; thermal analysis; commutation; conduction; electrical empirical model; electrothermal model; finite-element method; hybrid power components; insulated-gate bipolar transistor; power modules; simulation; steady-state conditions; temperature distribution; thermal behavior; thermal model; Circuit simulation; Electrothermal effects; Finite element methods; Insulation; Semiconductor process modeling; Steady-state; Temperature distribution; Temperature measurement; Temperature sensors; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Society Annual Meeting, 1992., Conference Record of the 1992 IEEE

Conference_Location

Houston, TX

Print_ISBN

0-7803-0635-X

Type

conf

DOI

10.1109/IAS.1992.244426

Filename

244426