DocumentCode :
3363640
Title :
Misalignment of the Block Oxide Height in Self-Aligned bSPIFET
Author :
Lin, Jyi-Tsong ; Eng, Yi-Chuen
Author_Institution :
Nat. Sun Yat-Sen Univ., Kaohsiung
fYear :
2007
fDate :
May 30 2007-June 1 2007
Firstpage :
1
Lastpage :
4
Abstract :
For the purpose of performance improvement from bSPIFET (Si on partial insulator with block oxide field-effect transistor) technology [1], a self-aligned bSPIFET was proposed. However, a lot of electrical characteristics have not yet been studied in detail. This paper aims to investigate the device behaviour of self-aligned bSPIFET as a function of misaligned block oxide height. According to the TCAD simulation, the misalignment of the block oxide height makes the fluctuation in electrical characteristics (e.g., drain-induced barrier lowering DIBL, subthreshold swing, leakage current), hence the etch rate of oxide for the block spacer formation becomes one of the key parameters for self-aligned bSPIFET process. This is due to the block oxide height enclosing the Si-body, which decides the blocked regions between body and source/drain (S/D). In brief, the main function of the block oxide is to diminish the charge sharing for improving the device performance.
Keywords :
CMOS integrated circuits; field effect transistors; insulators; CMOS devices; Si complementary metal-oxide-semiconductor devices; block oxide height; partial insulator field-effect transistor; self-aligned bSPIFET; Chemical vapor deposition; Dielectrics and electrical insulation; Dry etching; Electric variables; FETs; Fluctuations; Leakage current; MOSFETs; Semiconductor films; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Circuit Design and Technology, 2007. ICICDT '07. IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
1-4244-0757-5
Electronic_ISBN :
1-4244-0757-5
Type :
conf
DOI :
10.1109/ICICDT.2007.4299555
Filename :
4299555
Link To Document :
بازگشت