Title :
Technology and Application of 3D Interconnect
Author_Institution :
Freescale Semicond., Austin
fDate :
May 30 2007-June 1 2007
Abstract :
3D interconnection offers a number of advantages for system integration over other techniques such as system-on-chip and system-in-package. In many situations 3D integration can offer the interconnect performance associated with system on chip while allowing the process differentiation of system in package. However, 3D integration does require a number of new process technologies which are the subject of substantial research. Additionally, 3D interconnection introduces new design challenges and opportunities.
Keywords :
integrated circuit design; integrated circuit interconnections; system-in-package; system-on-chip; 3D interconnection application; design aspects; interconnect performance; system integration; system process differentiation; system-in-package; system-on-chip; Electronics industry; Integrated circuit interconnections; LAN interconnection; Paper technology; Power system interconnection; Semiconductor device packaging; Semiconductor devices; Space technology; System-on-a-chip; USA Councils;
Conference_Titel :
Integrated Circuit Design and Technology, 2007. ICICDT '07. IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
1-4244-0757-5
Electronic_ISBN :
1-4244-0757-5
DOI :
10.1109/ICICDT.2007.4299567
