DocumentCode
3363845
Title
3D System Integration Technologies
Author
Beyne, Eric ; Swinnen, Bart
fYear
2007
fDate
May 30 2007-June 1 2007
Firstpage
1
Lastpage
3
Abstract
3D technologies hold the promise to further enable increased system performance in a time where scaling has become increasingly challenging. However, 3D technologies will need to be tailored to the needs of the application they will serve. This paper describes different 3D integration schemes that are currently investigated at IMEC.
Keywords
integrated circuit interconnections; 3D system integration technology; IMEC; Ambient intelligence; Copper; Integrated circuit interconnections; Integrated circuit technology; Intelligent sensors; Packaging; Power system interconnection; Stacking; System performance; Through-silicon vias; Hybrid integrated circuit fabrication;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuit Design and Technology, 2007. ICICDT '07. IEEE International Conference on
Conference_Location
Austin, TX
Print_ISBN
1-4244-0757-5
Electronic_ISBN
1-4244-0757-5
Type
conf
DOI
10.1109/ICICDT.2007.4299568
Filename
4299568
Link To Document