Title :
3D System Integration Technologies
Author :
Beyne, Eric ; Swinnen, Bart
fDate :
May 30 2007-June 1 2007
Abstract :
3D technologies hold the promise to further enable increased system performance in a time where scaling has become increasingly challenging. However, 3D technologies will need to be tailored to the needs of the application they will serve. This paper describes different 3D integration schemes that are currently investigated at IMEC.
Keywords :
integrated circuit interconnections; 3D system integration technology; IMEC; Ambient intelligence; Copper; Integrated circuit interconnections; Integrated circuit technology; Intelligent sensors; Packaging; Power system interconnection; Stacking; System performance; Through-silicon vias; Hybrid integrated circuit fabrication;
Conference_Titel :
Integrated Circuit Design and Technology, 2007. ICICDT '07. IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
1-4244-0757-5
Electronic_ISBN :
1-4244-0757-5
DOI :
10.1109/ICICDT.2007.4299568
