Electrical, thermal and warpage investigation on high bandwidth PoP

Package-on-package (PoP) is widely used in smartphone to provide high bandwidth between application processor and memory. The content of communication is rapidly changing from text to picture and video, which creates an insatiable demand for bandwidth. In order to get bandwidth increased, one way is to increase the number of data I/O. Therefore, an improvement of current PoP structure to increase the number of interconnects becomes very important and imperative. In this work, three High Bandwidth PoP (HB PoP) structures are proposed and investigated in electrical, thermal and warpage performance through modeling. Compared with conventional PoP, the study shows that the proposed HB PoPs have superior warpage performance, and comparable electrical and thermal performance with conventional PoP.