• DocumentCode
    3364144
  • Title

    Elimination of signal integrity problems of boundary scan circuit based on frequency domain transfer coefficient method

  • Author

    Xing-Ming Li ; Shan-Qing Hu ; Kye-Yak See ; Eng-Kee Chua

  • Author_Institution
    Radar Res. Lab., Beijing Inst. of Technol., Beijing, China
  • fYear
    2013
  • fDate
    11-13 Dec. 2013
  • Firstpage
    579
  • Lastpage
    584
  • Abstract
    Most designers do not pay much attention to the boundary scan circuit (BSC) design because of its relatively low operating frequency, typically in the range of 10 to 100MHz. However, with the advancement of transistor technology, the shorter transistor switching time makes signal integrity (SI) a critical design issue for multi-interconnect systems (MIS). This paper investigates the BSC in MIS from the SI perspective. A method based on Frequency Domain Transfer Coefficient (FDTC) is proposed to eliminate the SI problems during the early BSC design stage. The method analyzes SI problems of the boundary scan signals in frequency-domain and offers an insight of the root cause of the SI problems. With the method, the designers can avoid unnecessary design iterations to achieve optimal SI performance.
  • Keywords
    boundary scan testing; frequency-domain analysis; integrated circuit design; integrated circuit interconnections; optimisation; BSC design; FDTC; MIS; boundary scan circuit design; boundary scan signals; frequency 10 MHz to 100 MHz; frequency domain transfer coefficient; multiinterconnect systems; optimal SI performance; signal integrity; transistor switching time; transistor technology; Conferences; Decision support systems; Electronics packaging; Joint Test Action Group (JTAG); boundary scan circuit (BSC); frequency domain transfer foefficient (FDTC); multi-interconnect systems (MIS); signal integrity (SI);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4799-2832-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2013.6745786
  • Filename
    6745786