Title : 
Histological response to implantation of microstimulators on the bladder wall: short term results
         
        
            Author : 
Walter, James S. ; Riedy, Lisa ; King, William ; Dunn, Robert ; Wheeler, J.S. ; Najafi, Khalil ; Dokmeci, Mehmet
         
        
            Author_Institution : 
Rehabilitation Res. & Dev. Center, Edward Hines VA Hosp., Hines, IL, USA
         
        
        
        
            fDate : 
30 Oct-2 Nov 1997
         
        
        
            Abstract : 
Small wireless microstimulators were implanted on the bladder wall serosa in three cats. The microstimulators were secured with a single polypropylene suture. Two to three microstimulators were implanted in each animal. The stimulators were implanted for eight weeks, and gross observation revealed encapsulation of the microstimulators with no perforation into the bladder lumen or migration from the bladder wall. Histological evaluation confirmed that all the microstimulators were encapsulated with a thin connective tissue sheath and a thickened subserosal layer. Only two microstimulators in one cat revealed a moderate to severe inflammatory response confined to a small area around the stimulator. These results indicate that the microstimulator can be further evaluated for implantation and stimulation of the urinary bladder
         
        
            Keywords : 
biological organs; encapsulation; neuromuscular stimulation; prosthetics; 8 w; bladder wall serosa; cats; histological response; inflammatory response; lumen; microstimulators encapsulation; microstimulators implantation; migration from bladder wall; perforation; small wireless microstimulators; thickened subserosal layer; thin connective tissue sheath; Animals; Bladder; Cables; Cats; Circuit testing; Electrodes; Hospitals; Research and development; Silicon; Surgery;
         
        
        
        
            Conference_Titel : 
Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
         
        
            Conference_Location : 
Chicago, IL
         
        
        
            Print_ISBN : 
0-7803-4262-3
         
        
        
            DOI : 
10.1109/IEMBS.1997.757076