DocumentCode :
3364856
Title :
A scalable parallel hardware architecture for connected component labeling
Author :
Lin, Chung-Yuan ; Li, Sz-Yan ; Tsai, Tsung-Han
Author_Institution :
Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan
fYear :
2010
fDate :
26-29 Sept. 2010
Firstpage :
3753
Lastpage :
3756
Abstract :
The parallel connected component labeling used in binary image analysis is reconsidered in this paper for the high throughput and intermediate memory requirements problem on high dimensional image sequence. It is based on a proposed dual-parallel connected component labeling method. The main idea is to break the sequentiality of the labeling procedure by separating image into slices and to correctly delimit the extent of all connected components locally, on each slice, simultaneously. According to the proposed method, a scalable architecture which can be adaptive to different throughput requirement is derived. The proposed architecture consists of local label assignment, local label fusion, and global process unit. The forest structure is introduced to cope with both global and local label equivalent. Based on the forest structure, find and union operations are implemented to complete the entire connected components labeling during two raster scans. Performance of the proposed architecture estimated in terms of the number of clocks and memory requirement are brought forward to justify the superiority of the novel design compared against previous implementation.
Keywords :
image segmentation; image sequences; binary image analysis; forest structure; global process unit; high dimensional image sequence; local label assignment; local label fusion; parallel connected component labeling; scalable parallel hardware architecture; Hardware; Labeling; Memory management; Merging; Pixel; Registers; Connected component; labeling algorithm; real-time; scalable architecture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Image Processing (ICIP), 2010 17th IEEE International Conference on
Conference_Location :
Hong Kong
ISSN :
1522-4880
Print_ISBN :
978-1-4244-7992-4
Electronic_ISBN :
1522-4880
Type :
conf
DOI :
10.1109/ICIP.2010.5653457
Filename :
5653457
Link To Document :
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