Experimental and numerical analysis of a microstrip/stripline-coupling scheme for multi-layer planar antennas

Author

Dhouib, A. ; Stubbs, M.G. ; Lecours, M.

Author_Institution

Communication Res. Centre, Ottawa, Ont., Canada

Volume

3

fYear

1994

fDate

20-24 June 1994

Firstpage

1718

Abstract

This paper presents the analysis of a coupling scheme for potential applications in planar phased array antennas. The configuration uses two microstrip substrates and an intervening stripline substrate to facilitate vertical signal distribution from RF circuit elements to patch antennas. The power is coupled between the different layers through apertures in the common ground planes of adjacent substrates. A full wave electromagnetic analysis based on the three dimensional transmission line matrix (3D-TLM) method is used to model the microstrip to stripline coupling discontinuity. The results obtained by this numerical analysis are compared to measured data (at around 5 GHz).

Keywords

antenna phased arrays; microstrip discontinuities; microwave antenna arrays; numerical analysis; strip line discontinuities; substrates; transmission line matrix methods; 3D-TLM method; 5 GHz; RF circuit elements; SHF; apertures; common ground planes; coupling discontinuity; experimental analysis; full wave electromagnetic analysis; measured data; microstrip substrates; microstrip/stripline-coupling; multi-layer planar antennas; numerical analysis; patch antennas; planar phased array antennas; stripline substrate; three dimensional transmission line matrix; vertical signal distribution; Antenna arrays; Coupling circuits; Microstrip antenna arrays; Microstrip antennas; Numerical analysis; Phased arrays; RF signals; Radio frequency; Stripline; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 1994. AP-S. Digest

Conference_Location

Seattle, WA, USA

Print_ISBN

0-7803-2009-3

Type

conf

DOI

10.1109/APS.1994.408118

Filename

408118