Title :
Ultra Wide Band Band Pass filter embedding a MLF low cost package with wire bound attach process
Author :
Cubillo, J.R. ; Gaubert, J. ; Bourdel, S. ; Barthélémy, H. ; Battista, M. ; Egels, Matthieu
Author_Institution :
L2MP, Marseille
Abstract :
In this paper we propose a design methodology to synthesize a band pass (BP) filter while embedding a package transition using wire bound attach process. The BP filter uses quarter wave coplanar line at the PCB level, the package transition and passive elements on DIE. The BP filter is designed for a low noise amplifier (LNA) receiver in the ECC-UWB band (6-8,5 GHz).
Keywords :
band-pass filters; coplanar transmission lines; integrated circuit packaging; low noise amplifiers; receivers; PCB; low noise amplifier receiver; micro lead frame package; quarter wave coplanar line; ultra wide band band pass filter; wire bound attach process; Band pass filters; Costs; Dielectric losses; Inductance; Packaging; Passive filters; Shunt (electrical); Transmission line matrix methods; Ultra wideband technology; Wire;
Conference_Titel :
Electronics, Circuits and Systems, 2007. ICECS 2007. 14th IEEE International Conference on
Conference_Location :
Marrakech
Print_ISBN :
978-1-4244-1377-5
Electronic_ISBN :
978-1-4244-1378-2
DOI :
10.1109/ICECS.2007.4511146
