DocumentCode :
3365379
Title :
High performance integrated passive devices (ipds) on low cost through silicon interposer (LC-TSI)
Author :
Cheng Jin ; Boyu Zheng ; Liang Ding ; Rui Li ; Kafai Chang
Author_Institution :
Inst. of Microelectron., Agency for Sci., Technol. & Res. (A*STAR, Singapore, Singapore
fYear :
2013
fDate :
11-13 Dec. 2013
Firstpage :
840
Lastpage :
843
Abstract :
This paper presents the design, fabrication and characterization of integrated passive devices (IPDs) on low cost through silicon interposer (LC-TSI). The performance of symmetrical spiral inductors is presented and analyzed in this paper. The effect of space between traces and the width of the trace on the Q-factor are studied. In addition, the inductors with TSV around and under are also discussed. On the TSI platform, some radio-frequency (RF) IPDs are also designed, including a millimeter-wave (mmWave) antenna working at 77 GHz for the automotive radar application. A bandpass filter based on the quarter-mode substrate integrated waveguide (QMSIW) is also designed on the TSI platform. The performance of these structures is given and the results show that the TSI platform is an attractive and promising method as a carrier to design IPDs and RF-IPD working at high frequency.
Keywords :
band-pass filters; inductors; millimetre wave antennas; road vehicle radar; substrate integrated waveguides; three-dimensional integrated circuits; LC-TSI; Q-factor; QMSIW; RF IPD; automotive radar application; bandpass filter; frequency 77 GHz; high performance integrated passive devices; low cost through silicon interposer; millimeter-wave antenna; mmWave antenna; quarter-mode substrate integrated waveguide; radiofrequency IPD; symmetrical spiral inductors; Antennas; Band-pass filters; Inductors; Q-factor; Silicon; Substrates; Through-silicon vias; Bandpass filter (BPF); integrated passive device (IPD); low-cost through silicon interposer (LC-TSI) millimetre-wave (mmWave);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-2832-3
Type :
conf
DOI :
10.1109/EPTC.2013.6745840
Filename :
6745840
Link To Document :
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