The process and thermal management performance of the flushbonading embedded active device in organic substrate

This paper mainly does research about the chip embedded based on the organic substrates. That puts forward a new flushbonading embedded structure of the organic substrates embedded. The structure can solve the problem of heat dissipation of the embedded technology. And in view of the structure, we do some simulation about the thermal management using the ansys soft and optimize and explore the embedded process, and eventually produce the active organic substrate samples. The structure in the paper uses the symmetrical form. That can avoid the problem of the substrate warpage in the process. And the flushbonading structure can add the copper to spread the heat of the active chip on the transverse. That can connect the thermal via to form the whole heat dissipation channel to make the embedded heat spill out the external environment. In addition, the structure has some other advantage. The flushbonading copper groove has the electromagnetic shielding effect and improves the EMC performance in the embedded system. Through the simulation using the ansys soft, we optimize the structure parameters and evaluate the thermal management performance. The thermal management can improve at least 10% according to the package thermal resistance when the power of chip is less than 0.8W. In the process, we have done the sample of the embedded structure through the process and using the mature and lowcost organic substrate process. The sample has passed E-test and reliability test of reflow.