Simulation for power integrity to design a PCB for an optimum cost

One of the biggest design challenges today is to properly design, manufacture, simulate and validate a Power Distribution Network (PDN) in systems with increasing speed, power dissipation and density. PDN are typically comprised of capacitors networks that have several types of capacitors and values to obtain target impedance over the required frequency range for the power/ground planes on PCBs. Capacitors provide a temporary source of localized energy for instantaneous current demands from an IC, and a low-impedance return path for high frequency noise. This paper propose a simulation test for a 4 layer PCB, with power/ground planes, to evaluate the effectiveness and importance of decoupling capacitors, using tools and methodologies to determine the important factors like performance, cost and board area.