DocumentCode
3365932
Title
The Relationship between Organizational Career Management and Job Satisfaction: An Empirical Study on Software R&D Professionals
Author
Wu Wenhua
Author_Institution
Sch. of Manage., Hunan Univ., Changsha
fYear
2008
fDate
4-6 Nov. 2008
Firstpage
593
Lastpage
598
Abstract
The primary purpose of this paper is to explore the relationship between organizational career management (OCM) and job satisfaction (JS). The measurements we used were the OCM scale developed by Long Lirong and JS scale developed by Smith et al. We conducted questionnaires survey in twelve software enterprises in China and acquired a sample of 141. The results showed that the correlation between OCM as a whole and JS, as well as the correlation between each dimension of OCM and JS, was significant. Among the OCM dimensions, the "Vocational Cognizance" is most correlated with the JS while "Fair Career Promotion" is least correlated. And the demographical variables have certain impacts over the correlation between software R&D professionals\´ perception toward OCM and their JS. The conclusion was that our software enterprises could increase R&D professionals\´ job satisfaction though improving OCM level, serving to lower the turnover rate of software R&D professionals and to offer guarantee for the stable and fast development of software industry.
Keywords
DP industry; human resource management; organisational aspects; research and development; China; job satisfaction; organizational career management; software R&D professionals; software enterprises; software industry; Career development; Companies; Computer industry; Conference management; Engineering management; Engineering profession; Humans; Research and development; Research and development management; Risk management; Career development; Job satisfaction; Organizational career management; Software R&D professionals;
fLanguage
English
Publisher
ieee
Conference_Titel
Risk Management & Engineering Management, 2008. ICRMEM '08. International Conference on
Conference_Location
Beijing
Print_ISBN
978-0-7695-3402-2
Type
conf
DOI
10.1109/ICRMEM.2008.61
Filename
4673297
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