DocumentCode :
3366280
Title :
Workflow design and management for IC supply chain
Author :
Chen, James C. ; Rau, Hsin ; Sun, Cheng-ju ; Stzeng, Hung-Wen ; Chia-Hsun Chen
Author_Institution :
Dept. of Ind. & Syst. Eng., Chung Yuan Christian Univ., Chungli
fYear :
2009
fDate :
26-29 March 2009
Firstpage :
697
Lastpage :
701
Abstract :
This research develops interaction models among companies in IC supply chain to study the information integration among them. The main processes of IC supply chain are IC design, wafer fabrication, wafer probe, IC packaging/assembly, and final test. A workflow model between IC design houses and wafer fabrication plants is developed with focuses on purchase order, engineering data, and work-in-process status. This model facilitates the standardization and simplification for the information integration interfaces, which could increase the communication efficiency and effectiveness between customers and vendors. Finally, Extricity Alliance software is used in a case study to demonstrate the interaction process and information flow between IC design houses and wafer fabrication plants.
Keywords :
CAD; integrated circuit design; integrated circuit manufacture; production engineering computing; supply chain management; work in progress; IC assembly; IC design houses; IC packaging; IC supply chain; engineering data; information integration interfaces; purchase order; wafer fabrication plants; wafer probe; work-in-process status; workflow design; Assembly; Data engineering; Fabrication; Integrated circuit modeling; Integrated circuit packaging; Integrated circuit testing; Probes; Semiconductor device modeling; Supply chain management; Supply chains;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Networking, Sensing and Control, 2009. ICNSC '09. International Conference on
Conference_Location :
Okayama
Print_ISBN :
978-1-4244-3491-6
Electronic_ISBN :
978-1-4244-3492-3
Type :
conf
DOI :
10.1109/ICNSC.2009.4919362
Filename :
4919362
Link To Document :
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