Title :
Direct electrocaloric measurements using a differential scanning calorimeter
Author :
Sanlialp, Mehmet ; Shvartsman, Vladimir V. ; Lupascu, Doru C. ; Molin, Christian ; Gebhardt, Sylvia
Author_Institution :
Inst. for Mater. Sci., Univ. of Duisburg-Essen, Essen, Germany
Abstract :
The electrocaloric effect (ECE) in ferroelectric materials is a promising mechanism for the development of small, effective, low cost, and environmentally friendly solid state refrigerators. During the last decade, an increased interest has been paid to studies of this effect. Getting reliable values requires direct measurements of the ECE instead of the frequently used indirect estimates based on Maxwell´s relation. In this paper, we report on the modification of a differential scanning calorimeter for direct ECE measurements. The importance of proper estimation of the heat capacitance and thermal losses for the correct ECE measurements is discussed. The ECE was measured for bulk ceramics Ba(Zr0.2Ti0.8)O3. The temperature change reaches a value of ΔTEC= 0.44 K at 305 K under an electric field of 2 kV/mm. The obtained data are compared with results of the evaluation of the indirect ECE.
Keywords :
barium compounds; calorimeters; ceramics; dielectric measurement; differential scanning calorimetry; heat losses; pyroelectricity; specific heat; Ba(Zr0.2Ti0.8)O3; DSC; Maxwell´s relation; bulk ceramics; differential scanning calorimeter modification; direct electrocaloric effect measurements; electric field; ferroelectric materials; heat capacitance estimation; solid state refrigerators; temperature 305 K; temperature change; thermal loss estimation; Ceramics; Electric fields; Extraterrestrial measurements; Heating; Loss measurement; Temperature measurement; Thermal factors; BZT; Dielectric; Electrocaloric effect; Lead-free ferroelectric; field-induced phase transition;
Conference_Titel :
Applications of Ferroelectric, International Symposium on Integrated Functionalities and Piezoelectric Force Microscopy Workshop (ISAF/ISIF/PFM), 2015 Joint IEEE International Symposium on the
Conference_Location :
Singapore
DOI :
10.1109/ISAF.2015.7172694