Title :
3D electromagnetic chip package simulation for high-speed serial interface application
Author :
Rydygier, Adam ; Kakerow, Ralf ; Munteanu, Irina ; Buchmann, Michael ; Muller, Mathias
Author_Institution :
Nokia Res. Center, Nokia GmbH, Bochum
Abstract :
In this paper a 3D electromagnetic (EM) modeling approach of a 64-pin shrink quad flat package (SQFP) is presented. The package contains the physical layer IC implementation of a high-speed chip-to-chip serial transmitter/receiver for the performance evaluation of a pre-version of the MIPI D-PHY standard. The paper describes the simulation methodology starting from gathering package information regarding dimension-s through datasheets and X-ray pictures. Subsequently, a three-dimensional model is built and analyzed in 3D electromagnetic simulation software. Package characterization techniques in frequency and time domain are applied. Finally, a network model for use in a circuit simulator is derived. Finally, relevant constraints of this modeling approach are discussed.
Keywords :
high-speed integrated circuits; integrated circuit modelling; integrated circuit packaging; 3D electromagnetic chip package simulation; 3D electromagnetic modeling; 3D electromagnetic simulation software; 64-pin shrink quad flat package; circuit simulator; high-speed chip-to-chip serial transmitter/receiver; high-speed serial interface application; package characterization techniques; Bonding; Circuit simulation; Electromagnetic modeling; Electronics packaging; Equivalent circuits; Integrated circuit interconnections; RLC circuits; Software packages; Solid modeling; Wire; Electrical characterization; MIPI; chip packages; electromagnetic simulation; equivalent circuit modeling; finite difference;
Conference_Titel :
Signals and Electronic Systems, 2008. ICSES '08. International Conference on
Conference_Location :
Krakow
Print_ISBN :
978-83-88309-47-2
Electronic_ISBN :
978-83-88309-52-6
DOI :
10.1109/ICSES.2008.4673358
