Simulations of passive components in LTCC technology

The particular group of passives are magnetic and capacitive devices, which electrical parameters are tightly correlated with their geometry. A great variety of inductors and capacitors manufactured in different technologies are commonly applied in electronic circuits. Special attention should be paid at planar components that can be easily fabricated for example by thick-film and LTCC technology and integrated in Multi-Chip Modules (MCM). This paper presents some theoretical studies of planar inductors and capacitors. Specialised software for high-frequency EM (Electromagnetic) analysis was used for investigation of correlations between geometry of planar components and its basic parameters. Influence of planar dimensions, width of conductor paths and spacing on inductance/capacitance, quality factor and resonance frequency was determined.