Evaluation of 300 mm wafer boxes with UV/photoelectron cleaning capability

Author

Yokoyama, S. ; Hara, Yoshitaka ; Yoshino, T. ; Suzuki, T. ; Fujii, T. ; Ohyama, K.

Author_Institution

Res. Center for Nanodevices & Syst., Hiroshima Univ., Japan

fYear

1999

fDate

1999

Firstpage

169

Lastpage

172

Abstract

New plastic wafer boxes with cleaning capability for gaseous contamination harmful to LSI fabrication processes have been developed. The contamination gases are effectively reduced by attaching a UV/photoelectron cleaning unit to the conventional polycarbonate plastic box. The performance of the wafer boxes has been verified by a reliability test of thin gate oxides fabricated on Si wafers stored in the boxes. It is also shown that a newly developed plastic material is superior to polycarbonate in terms of the organic molecule contaminants

Keywords

MOS capacitors; ULSI; chromatography; contact angle; electron-surface impact; integrated circuit manufacture; integrated circuit packaging; integrated circuit reliability; plastic packaging; surface cleaning; surface contamination; ultraviolet radiation effects; 300 mm; 300 mm wafer boxes; LSI fabrication process; MOS capacitors; Si wafers; Si-SiO₂; ULSI manufacture; UV/photoelectron cleaning capability; gaseous contamination; gate oxide reliability; organic molecule contaminants; plastic material; plastic wafer boxes; polycarbonate plastic box; reliability test; thin gate oxides; total ion chromatography spectra; Cleaning; Fabrication; Gases; Large scale integration; MOS capacitors; Material storage; Plastics; Surface contamination; Ultra large scale integration; Water storage;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on

Conference_Location

Santa Clara, CA

ISSN

1523-553X

Print_ISBN

0-7803-5403-6

Type

conf

DOI

10.1109/ISSM.1999.808764

Filename

808764