A proposal for energy saving in semiconductor fabs

Author

Suenaga, Osamu ; Kobayashi, Sadao ; Ohmi, Tadahiro

Author_Institution

Tokyo Electron Ltd., Japan

fYear

1999

fDate

1999

Firstpage

255

Lastpage

258

Abstract

This paper describes measurement of the energy consumption of diffusion furnaces and proceeds to propose several methods for energy saving. Measurements showed that cooling water consumes 71% of the energy, exhaust air 11% and dry coil (heat transferred to clean room air) 18%. In terms of cost (in Yen), cooling water accounts for 32%, exhaust air 46% and dry coil 22%. Proposals are raised for reducing the energy consumption of the furnace to less than a half of conventional ones by: employment of double layer cooler; replacement of exhaust from clean room air by partially treated air; and employment of heat insulation material for the furnace casing

Keywords

clean rooms; cooling; furnaces; integrated circuit manufacture; thermal insulation; clean room air; cooling water; cost; diffusion furnaces; double layer cooler; dry coil; energy consumption; energy saving; exhaust air; furnace casing; heat insulation material; partially treated air; semiconductor fabs; Coils; Cooling; Costs; Employment; Energy consumption; Energy measurement; Furnaces; Heat transfer; Proposals; Water heating;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on

Conference_Location

Santa Clara, CA

ISSN

1523-553X

Print_ISBN

0-7803-5403-6

Type

conf

DOI

10.1109/ISSM.1999.808784

Filename

808784