DocumentCode
3367831
Title
Advanced process control system description of an easy-to-use control system incorporating pluggable modules
Author
Fukuda, Etsuo ; Harakawa, Shoichi ; Ikeda, Makoto
Author_Institution
Manuf. Eng. Centre, Toshiba Corp., Yokohama, Japan
fYear
1999
fDate
1999
Firstpage
321
Lastpage
324
Abstract
We have developed an advanced process control (APC) system into which it is easy to plug the calculation methods and formulae for process control which are appropriate for a given product, recipe and set of production equipment data. Many different types of recipe are used in multi-product production lines to produce logic devices, for example. In general, the process control method depends on the recipe. In a conventional process control system, a control program corresponding to the recipe must be developed. Developing programs capable of coping with an increasing number of product types or recipes is very hard. The chief characteristic of the APC system which we have developed is that programs are classified into two distinct types: programs which do not depend on either the recipe or the equipment, and programs which do. Our APC system has already been introduced on trial lines for the following processes in which there has been a large increase in the number of recipes: lithography, reactive ion etching (RIE), chemical dry etching (CDE), wet etching, oxidation, chemical vapor deposition (CVD), sputtering and chemical mechanical polishing (CMP). High-speed implementation of process control programs (up to three recipes per day) has been achieved
Keywords
chemical mechanical polishing; chemical vapour deposition; etching; integrated circuit manufacture; lithography; manufacturing data processing; oxidation; process control; production engineering computing; sputter etching; CMP; CVD; RIE; advanced process control system description; chemical dry etching; chemical mechanical polishing; chemical vapor deposition; easy-to-use control system; lithography; multi-product production lines; oxidation; pluggable modules; process control program implementation; process recipes; production equipment data; reactive ion etching; sputtering; wet etching; Chemical processes; Chemical vapor deposition; Control systems; Dry etching; Lithography; Logic devices; Plugs; Process control; Production equipment; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1523-553X
Print_ISBN
0-7803-5403-6
Type
conf
DOI
10.1109/ISSM.1999.808800
Filename
808800
Link To Document