• DocumentCode
    3367831
  • Title

    Advanced process control system description of an easy-to-use control system incorporating pluggable modules

  • Author

    Fukuda, Etsuo ; Harakawa, Shoichi ; Ikeda, Makoto

  • Author_Institution
    Manuf. Eng. Centre, Toshiba Corp., Yokohama, Japan
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    321
  • Lastpage
    324
  • Abstract
    We have developed an advanced process control (APC) system into which it is easy to plug the calculation methods and formulae for process control which are appropriate for a given product, recipe and set of production equipment data. Many different types of recipe are used in multi-product production lines to produce logic devices, for example. In general, the process control method depends on the recipe. In a conventional process control system, a control program corresponding to the recipe must be developed. Developing programs capable of coping with an increasing number of product types or recipes is very hard. The chief characteristic of the APC system which we have developed is that programs are classified into two distinct types: programs which do not depend on either the recipe or the equipment, and programs which do. Our APC system has already been introduced on trial lines for the following processes in which there has been a large increase in the number of recipes: lithography, reactive ion etching (RIE), chemical dry etching (CDE), wet etching, oxidation, chemical vapor deposition (CVD), sputtering and chemical mechanical polishing (CMP). High-speed implementation of process control programs (up to three recipes per day) has been achieved
  • Keywords
    chemical mechanical polishing; chemical vapour deposition; etching; integrated circuit manufacture; lithography; manufacturing data processing; oxidation; process control; production engineering computing; sputter etching; CMP; CVD; RIE; advanced process control system description; chemical dry etching; chemical mechanical polishing; chemical vapor deposition; easy-to-use control system; lithography; multi-product production lines; oxidation; pluggable modules; process control program implementation; process recipes; production equipment data; reactive ion etching; sputtering; wet etching; Chemical processes; Chemical vapor deposition; Control systems; Dry etching; Lithography; Logic devices; Plugs; Process control; Production equipment; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-5403-6
  • Type

    conf

  • DOI
    10.1109/ISSM.1999.808800
  • Filename
    808800