Investigating the mechanical strength of Vapor Phase soldered chip components joints

Author

Krammer, Olivér ; Garami, Tamás

Author_Institution

Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary

fYear

2010

fDate

23-26 Sept. 2010

Firstpage

103

Lastpage

106

Abstract

In our experiment the mechanical strength of solder joints formed by Vapor Phase soldering was investigated. A testboard was designed, which allowed fifty pieces of 0603 size chip resistors to be placed. The soldering was carried out by infrared conventional reflow and by Vapor Phase reflow as well. After soldering the shear strength of joints formed by both of the soldering methods was measured, and the cross-section of solder joints was analyzed by Scanning Electron Microscopy. Based on the results, it can be said that the shear strength of joints formed by Vapor Phase soldering is slightly lower than the strength of joints formed by IR reflow. The thermal profile of Vapor Phase soldering needs further optimization. The detailed results are presented in the paper.

Keywords

reflow soldering; shear strength; chip components joints; infrared conventional reflow; mechanical strength; scanning electron microscopy; shear strength; solder joints; thermal profile; vapor phase reflow; vapor phase soldering; Heat transfer; Intermetallic; Joints; Resistors; Soldering; Temperature measurement; Shear strength; Vapor Phase soldering; soldered joints;

fLanguage

English

Publisher

ieee

Conference_Titel

Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for

Conference_Location

Pitesti

Print_ISBN

978-1-4244-8123-1

Type

conf

DOI

10.1109/SIITME.2010.5653622

Filename

5653622