Title :
Investigating the mechanical strength of Vapor Phase soldered chip components joints
Author :
Krammer, Olivér ; Garami, Tamás
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
Abstract :
In our experiment the mechanical strength of solder joints formed by Vapor Phase soldering was investigated. A testboard was designed, which allowed fifty pieces of 0603 size chip resistors to be placed. The soldering was carried out by infrared conventional reflow and by Vapor Phase reflow as well. After soldering the shear strength of joints formed by both of the soldering methods was measured, and the cross-section of solder joints was analyzed by Scanning Electron Microscopy. Based on the results, it can be said that the shear strength of joints formed by Vapor Phase soldering is slightly lower than the strength of joints formed by IR reflow. The thermal profile of Vapor Phase soldering needs further optimization. The detailed results are presented in the paper.
Keywords :
reflow soldering; shear strength; chip components joints; infrared conventional reflow; mechanical strength; scanning electron microscopy; shear strength; solder joints; thermal profile; vapor phase reflow; vapor phase soldering; Heat transfer; Intermetallic; Joints; Resistors; Soldering; Temperature measurement; Shear strength; Vapor Phase soldering; soldered joints;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for
Conference_Location :
Pitesti
Print_ISBN :
978-1-4244-8123-1
DOI :
10.1109/SIITME.2010.5653622
