Combined x-ray tool for process control of compound dielectric films

Author

Terada, Shinichi

Author_Institution

Technos Co. Ltd., Osaka, Japan

fYear

1999

fDate

1999

Firstpage

365

Lastpage

368

Abstract

Thickness is an important parameter that must be controlled in the production of films for microelectronic devices. If a film is composed of two or more components, composition control is also essential, because small changes in composition results in significant changes in the electric properties of dielectric materials. XRF has been used for the simultaneous determination of thickness and composition. However, there are several problems with this method. Therefore, we developed a new tool that combines the X-ray interference method (XI) and grazing incidence X-ray fluorescence method (GIXRF)

Keywords

X-ray diffraction; X-ray fluorescence analysis; chemical variables control; dielectric thin films; process control; thickness control; X-ray interference; combined X-ray tool; composition control; compound dielectric film; electric properties; grazing incidence X-ray fluorescence; microelectronic device; process control; thickness control; Composite materials; Dielectric films; Dielectric materials; Ferroelectric materials; Fluorescence; Interference; Optical films; Process control; Production; Thickness measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on

Conference_Location

Santa Clara, CA

ISSN

1523-553X

Print_ISBN

0-7803-5403-6

Type

conf

DOI

10.1109/ISSM.1999.808812

Filename

808812