DocumentCode
3368033
Title
Inspection optimization for excursion and baseline defect monitoring in a manufacturing environment
Author
Sajoto, D. ; Gordon, Aaron ; McCauley, Aaron
Author_Institution
Cypress Semicond., Bloomington, MN, USA
fYear
1999
fDate
1999
Firstpage
371
Lastpage
374
Abstract
This paper proposes a methodology for inspection optimization by utilizing correlation results between in-line defect to end-of-line bit failure, demonstrates its advantages, and shows how to achieve balance between the effectiveness and the efficiency of in-line defect inspection
Keywords
circuit optimisation; failure analysis; inspection; integrated circuit manufacture; process monitoring; baseline defect monitoring; end-of-line bit failure; excursion monitoring; in-line defect; inspection optimization; manufacturing environment; Condition monitoring; Delay; Failure analysis; Inspection; Optimization methods; Process control; Pulp manufacturing; Semiconductor device manufacture; Signal to noise ratio; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1523-553X
Print_ISBN
0-7803-5403-6
Type
conf
DOI
10.1109/ISSM.1999.808813
Filename
808813
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