Title :
Advanced defect-kill-rate estimation and yield analysis incorporating defect clustering
Author :
Kikuchi, Hiroaki ; Nishio, Naoharu ; Ikeyama, Kazutaka ; Misumi, Akiko
Author_Institution :
NEC, Kanagawa, Japan
Abstract :
A method is described for estimating the defect kill rate and analyzing the yield from line-monitoring data. The kill rate is obtained by solving simultaneous equations with respect to the number of good dies that include a specific defect. Simulation studies showed this new method to be more accurate than conventional methods when defect clustering occurs on a wafer. It will be useful for quantitative defect analysis and yield
Keywords :
cluster tools; failure analysis; integrated circuit yield; process monitoring; defect clustering; defect-kill-rate estimation; good dies; line-monitoring data; quantitative defect analysis; simultaneous equations; yield analysis; Circuit analysis; Circuit faults; Circuit testing; Equations; Estimation theory; Large Hadron Collider; Probes; Yield estimation;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-5403-6
DOI :
10.1109/ISSM.1999.808817
