DocumentCode :
3368177
Title :
Measurement point selection for in-operation wear-out monitoring
Author :
Ingelsson, Urban ; Chang, Shih-Yen ; Larsson, Erik
Author_Institution :
Dept. of Comput. & Inf. Sci., Linkopings Univ., Sweden
fYear :
2011
fDate :
13-15 April 2011
Firstpage :
381
Lastpage :
386
Abstract :
In recent IC designs, the risk of early failure due to electromigration wear-out has increased due to reduced feature dimensions. To give a warning of impending failure, wear-out monitoring approaches have included delay measurement circuitry on-chip. Due to the high cost of delay measurement circuitry this paper presents a method to reduce the number of necessary measurement points. The proposed method is based on identification of wear-out sensitive interconnects and selects a small number of measurement points that can be used to observe the state of all the wear-out sensitive interconnects. The method is demonstrated on ISCAS85 benchmark ICs with encouraging results.
Keywords :
electromigration; integrated circuit design; monitoring; IC designs; circuitry on-chip; electromigration wear-out; in-operation wear-out monitoring; measurement point selection; Circuit faults; Delay; Electromigration; Integrated circuit interconnections; Monitoring; Wireless sensor networks;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Diagnostics of Electronic Circuits & Systems (DDECS), 2011 IEEE 14th International Symposium on
Conference_Location :
Cottbus
Print_ISBN :
978-1-4244-9755-3
Type :
conf
DOI :
10.1109/DDECS.2011.5783115
Filename :
5783115
Link To Document :
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