DocumentCode :
3368202
Title :
A novel approach in modeling the diffusion of ion-implanted species during annealing
Author :
Su, T. ; Choi, P.S. ; Kwong, D.L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
fYear :
1995
fDate :
31 May-2 Jun 1995
Firstpage :
118
Lastpage :
121
Abstract :
A novel approach to diffusion modeling of ion implanted species which combines the best features of the two predominant methods of diffusion modeling, physical and empirical, has been used to accurately simulate boron diffusion for a wide range of implant doses and annealing conditions. The Hybrid model is a new approach which accounts for the evolution of point defects as in the physical model while retaining the computational efficiency of the empirical model through the use of a defect concentration dependent dopant effective diffusivity. The dimensionally independent model can account for a wide range of implant conditions and with the use of a single universal set of parameters can be easily implemented into a higher dimensional simulation making high speed 2D and 3D diffusion simulations possible. In addition, a dislocation loop and precipitation model are included for high dose implantation conditions
Keywords :
annealing; boron; dislocation loops; ion implantation; point defects; semiconductor process modelling; thermal diffusion; B diffusion; annealing; diffusion modeling; dimensionally independent model; dislocation loop; dopant effective diffusivity; high dose implantation conditions; hybrid model; implant doses; ion-implanted species; point defects; precipitation model; Boron; Computational efficiency; Computational modeling; Curve fitting; Equations; Implants; Microelectronics; Rapid thermal processing; Semiconductor process modeling; Simulated annealing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems, and Applications, 1995. Proceedings of Technical Papers. 1995 International Symposium on
Conference_Location :
Taipei
ISSN :
1524-766X
Print_ISBN :
0-7803-2773-X
Type :
conf
DOI :
10.1109/VTSA.1995.524645
Filename :
524645
Link To Document :
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