DocumentCode
3368202
Title
A novel approach in modeling the diffusion of ion-implanted species during annealing
Author
Su, T. ; Choi, P.S. ; Kwong, D.L.
Author_Institution
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
fYear
1995
fDate
31 May-2 Jun 1995
Firstpage
118
Lastpage
121
Abstract
A novel approach to diffusion modeling of ion implanted species which combines the best features of the two predominant methods of diffusion modeling, physical and empirical, has been used to accurately simulate boron diffusion for a wide range of implant doses and annealing conditions. The Hybrid model is a new approach which accounts for the evolution of point defects as in the physical model while retaining the computational efficiency of the empirical model through the use of a defect concentration dependent dopant effective diffusivity. The dimensionally independent model can account for a wide range of implant conditions and with the use of a single universal set of parameters can be easily implemented into a higher dimensional simulation making high speed 2D and 3D diffusion simulations possible. In addition, a dislocation loop and precipitation model are included for high dose implantation conditions
Keywords
annealing; boron; dislocation loops; ion implantation; point defects; semiconductor process modelling; thermal diffusion; B diffusion; annealing; diffusion modeling; dimensionally independent model; dislocation loop; dopant effective diffusivity; high dose implantation conditions; hybrid model; implant doses; ion-implanted species; point defects; precipitation model; Boron; Computational efficiency; Computational modeling; Curve fitting; Equations; Implants; Microelectronics; Rapid thermal processing; Semiconductor process modeling; Simulated annealing;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 1995. Proceedings of Technical Papers. 1995 International Symposium on
Conference_Location
Taipei
ISSN
1524-766X
Print_ISBN
0-7803-2773-X
Type
conf
DOI
10.1109/VTSA.1995.524645
Filename
524645
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