• DocumentCode
    3368202
  • Title

    A novel approach in modeling the diffusion of ion-implanted species during annealing

  • Author

    Su, T. ; Choi, P.S. ; Kwong, D.L.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
  • fYear
    1995
  • fDate
    31 May-2 Jun 1995
  • Firstpage
    118
  • Lastpage
    121
  • Abstract
    A novel approach to diffusion modeling of ion implanted species which combines the best features of the two predominant methods of diffusion modeling, physical and empirical, has been used to accurately simulate boron diffusion for a wide range of implant doses and annealing conditions. The Hybrid model is a new approach which accounts for the evolution of point defects as in the physical model while retaining the computational efficiency of the empirical model through the use of a defect concentration dependent dopant effective diffusivity. The dimensionally independent model can account for a wide range of implant conditions and with the use of a single universal set of parameters can be easily implemented into a higher dimensional simulation making high speed 2D and 3D diffusion simulations possible. In addition, a dislocation loop and precipitation model are included for high dose implantation conditions
  • Keywords
    annealing; boron; dislocation loops; ion implantation; point defects; semiconductor process modelling; thermal diffusion; B diffusion; annealing; diffusion modeling; dimensionally independent model; dislocation loop; dopant effective diffusivity; high dose implantation conditions; hybrid model; implant doses; ion-implanted species; point defects; precipitation model; Boron; Computational efficiency; Computational modeling; Curve fitting; Equations; Implants; Microelectronics; Rapid thermal processing; Semiconductor process modeling; Simulated annealing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications, 1995. Proceedings of Technical Papers. 1995 International Symposium on
  • Conference_Location
    Taipei
  • ISSN
    1524-766X
  • Print_ISBN
    0-7803-2773-X
  • Type

    conf

  • DOI
    10.1109/VTSA.1995.524645
  • Filename
    524645