Title :
Photoluminescence properties of rare-earth Nd,Ce doped Si-based materials
Author :
Yuan, Meiling ; Leng, Xinli ; Li, Chenfa ; Yan, Kun ; Wang, Qingnian
Author_Institution :
Dept. of Phys., Nanchang Univ., Nanchang, China
Abstract :
The photoluminescence (PL) spectra at room temperature for the silicon-based samples doped by Nd and Ce by ion implantation are measured. The results show that all the samples possess blue-violet photoluminescence properties under the ultraviolet light excitation and its light emission is stable. The intensity of PL spectra is closely relative to the dose of implantation and to the temperature of thermal annealing. The feature and appearance of the samples was surveyed with atomic force microscopy (AFM). The results show that the surface grain size and coarse degree for sample have influence on its light emission efficiency. The light emission efficiency is higher when the surface grain size is symmetrical and average coarse degree is little for samples. The Rutherford Backscattering Spectrum (RBS) at room temperature for the samples was measured, the relationship between of luminescence properties of samples and morphology in implanted layer is investigated. The photoluminescence mechanism for our samples is also discussed.
Keywords :
Rutherford backscattering; annealing; atomic force microscopy; cerium; grain size; ion implantation; neodymium; photoluminescence; silicon; Rutherford backscattering spectrum; Si:Nd,Ce; atomic force microscopy; blue-violet photoluminescence; ion implantation; light emission; photoluminescence spectra; rare earth; silicon-based samples; surface grain size; temperature 293 K to 298 K; thermal annealing; ultraviolet light excitation; Annealing; Atomic force microscopy; Backscatter; Grain size; Ion implantation; Luminescence; Neodymium; Photoluminescence; Surface morphology; Temperature; Photoluminescence; Rare-earth implantation; SiO2 thin film; Surface morphology;
Conference_Titel :
Mechatronics and Automation, 2009. ICMA 2009. International Conference on
Conference_Location :
Changchun
Print_ISBN :
978-1-4244-2692-8
Electronic_ISBN :
978-1-4244-2693-5
DOI :
10.1109/ICMA.2009.5246463