Fast thermal analysis for VLSI circuits via semi-analytical Green´s function in multi-layer materials

Author

Wang, Baohua ; Mazumder, Pinaki

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

Volume

2

fYear

2004

fDate

23-26 May 2004

Abstract

In this paper, a novel thermal analysis method for VLSI circuits based on the Green´s function of heat conduction problem is proposed. With the method the temperature distribution can be very efficiently evaluated for the simulated chip via the proposed semi-analytical Green´s function technique, by which the Green´s function can be calculated online using the Green´s function library obtained by inexpensive pre-characterization for the given chip structure. Experimental results validate the accuracy of the semi-analytical Green´s function and demonstrate the efficiency of the thermal analysis method. Our thermal analysis approach can well adapt to the situation of thermal simulation for chips with multilayer heterogeneous heat conduction materials.

Keywords

Green´s function methods; VLSI; heat conduction; integrated circuit design; multilayers; thermal analysis; VLSI circuit; chip structure; fast thermal analysis; multilayer heterogeneous heat conduction material; semianalytical Greens function; simulated chip; temperature distribution; thermal simulation; Analytical models; Circuit analysis; Circuit simulation; Conducting materials; Green´s function methods; Libraries; Nonhomogeneous media; Temperature distribution; Thermal conductivity; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on

Print_ISBN

0-7803-8251-X

Type

conf

DOI

10.1109/ISCAS.2004.1329295

Filename

1329295