Title :
High voltage IGBT (HV-IGBT) having p+/p- collector region
Author :
Suekawa, E. ; Tomomatsu, Y. ; Enjoji, T. ; Kondoh, H. ; Takeda, M. ; Yamada, T.
Author_Institution :
Mitsubishi Electr. Corp., Fukuoka-City, Japan
Abstract :
For high voltage IGBTs (HV-IGBTs; rated collector voltage over 2.5 kV), it is very important that the thickness of the n- layer (tn-) is thin to improve the trade-off relationship between collector-emitter saturation voltage (Vce(sat)) and turn-off switching loss (Eoff). A punch-through IGBT (PT-IGBT) with n + buffer layer thus has a better trade-off than that of a nonpunch-through IGBT (NPT-IGBT) without the n+ buffer layer. However, the HV-IGBT with thin tn- has much worse characteristics in that collector leakage current (ICES) is high and reverse bias safety operating area (RBSOA) is narrow. In order to solve these problems, we examined the collector region of a PT-IGBT. In this paper, we developed a HV-IGBT with a p+/p- collector region which has better characteristics in terms of the trade-off relationship between VCE(sat) and Eoff, and a wide RBSOA
Keywords :
doping profiles; insulated gate bipolar transistors; leakage currents; losses; power bipolar transistors; semiconductor device models; semiconductor device testing; switching; 2.3 kV; HV-IGBT; NPT-IGBT; PT-IGBT; collector leakage current; collector-emitter saturation voltage; high voltage IGBT; n+ buffer layer; n- layer thickness; nonpunch-through IGBT; p+/p- collector region; punch-through IGBT; rated collector voltage; reverse bias safety operating area; turn-off switching loss; Buffer layers; Charge carrier lifetime; Equations; Impurities; Insulated gate bipolar transistors; Leakage current; Temperature; Voltage;
Conference_Titel :
Power Semiconductor Devices and ICs, 1998. ISPSD 98. Proceedings of the 10th International Symposium on
Conference_Location :
Kyoto
Print_ISBN :
0-7803-4752-8
DOI :
10.1109/ISPSD.1998.702680