Title :
Board driven I/O planning & optimization
Author_Institution :
Mentor Graphics, Longmont, CO, USA
Abstract :
The overall cost of getting a chip ship in volume is a concern for many companies in today´s market. Industry leading companies are starting to implement co-design flows in hopes of reducing overall design cycles and cost. This paper proposes a novel approach to developing a co-design flow that is based on a new intelligent die abstract model (VDM) and a board driven methodology. This methodology has been used to save over 25% on a high volume production printed circuit board (PCB).
Keywords :
Vienna development method; printed circuit design; printed circuits; PCB; board driven I/O planning; board driven methodology; chip ship; codesign flows; intelligent die abstract model; overall design cost; overall design cycles; printed circuit board; Companies; Integrated circuit modeling; Layout; Optimization; Planning; Substrates;
Conference_Titel :
Computer-Aided Design (ICCAD), 2010 IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-8193-4
DOI :
10.1109/ICCAD.2010.5653704
