Title :
Tomorrow´s implantable electronic systems
Author_Institution :
Lincoln Lab., MIT, Lexington, MA, USA
fDate :
31 Oct-3 Nov 1996
Abstract :
Tomorrow´s implantable electronic systems are being developed using micro-machined integrated circuit technology. However, these systems will not find useful clinical applications until suitable insulating biomaterials are identified for protecting these devices from the environment of the body for many decades. A review of packaging issues for commercially successful implantable devices is followed by review of current work on developing packaging technology for tomorrow´s implantable electronic systems
Keywords :
biomedical electronics; integrated circuit packaging; pacemakers; prosthetics; reviews; body environment; cardiac pacemakers; commercially successful implantable devices; device protection; insulating biomaterials; micromachined integrated circuit technology; neuroprostheses; packaging issues; tomorrow´s implantable electronic systems; useful clinical applications; Acceleration; Batteries; Biological tissues; Electrodes; Electronics packaging; Implants; Insulation; Integrated circuit technology; Pacemakers; Titanium;
Conference_Titel :
Engineering in Medicine and Biology Society, 1996. Bridging Disciplines for Biomedicine. Proceedings of the 18th Annual International Conference of the IEEE
Conference_Location :
Amsterdam
Print_ISBN :
0-7803-3811-1
DOI :
10.1109/IEMBS.1996.646483
