Tomorrow´s implantable electronic systems

Author

Edell, David J.

Author_Institution

Lincoln Lab., MIT, Lexington, MA, USA

Volume

5

fYear

1996

fDate

31 Oct-3 Nov 1996

Firstpage

2174

Abstract

Tomorrow´s implantable electronic systems are being developed using micro-machined integrated circuit technology. However, these systems will not find useful clinical applications until suitable insulating biomaterials are identified for protecting these devices from the environment of the body for many decades. A review of packaging issues for commercially successful implantable devices is followed by review of current work on developing packaging technology for tomorrow´s implantable electronic systems

Keywords

biomedical electronics; integrated circuit packaging; pacemakers; prosthetics; reviews; body environment; cardiac pacemakers; commercially successful implantable devices; device protection; insulating biomaterials; micromachined integrated circuit technology; neuroprostheses; packaging issues; tomorrow´s implantable electronic systems; useful clinical applications; Acceleration; Batteries; Biological tissues; Electrodes; Electronics packaging; Implants; Insulation; Integrated circuit technology; Pacemakers; Titanium;

fLanguage

English

Publisher

ieee

Conference_Titel

Engineering in Medicine and Biology Society, 1996. Bridging Disciplines for Biomedicine. Proceedings of the 18th Annual International Conference of the IEEE

Conference_Location

Amsterdam

Print_ISBN

0-7803-3811-1

Type

conf

DOI

10.1109/IEMBS.1996.646483

Filename

646483